This comprehensive roadmap explores the technological evolution of optical modules over the next decade, examining the innovations in modulation techniques, photonic integration, packaging, and system architectures that will enable the exponential bandwidth growth required by AI. This comprehensive roadmap explores the technological evolution of optical modules over the next decade, examining the innovations in modulation techniques, photonic integration, packaging, and system architectures that will enable the exponential bandwidth growth required by AI. State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xi'an 710071, China The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, Guangzhou 510000, China The Science and Technology on Reliability Physics. This comprehensive roadmap explores the technological evolution of optical modules over the next decade, examining the innovations in modulation techniques, photonic integration, packaging, and system architectures that will enable the exponential bandwidth growth required by AI and other demanding. formats will contribute to this growth. In value, it is estimated that silicon photonic transceivers will make up 30% of the total optical transcei te) is calculated between 2022 and 2027. When. We'll examine Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO) as cost-effective, low-power alternatives, discuss advanced cooling solutions tackling the heat challenges of high-speed modules, and explore game-changing paradigms like Co-Packaged Optics (CPO), Optical Input/Output. The rise of Co-Packaged Optics (CPO) Over the past decade, the capacity of data center Ethernet switches has surged from 0. However, these high-speed modules, within their current form. Simultaneously, coherent technology has emerged as the prevailing solution for Data Center Interconnection (DCI) applications, covering distances of 80~120km in the field of data communication.
